Transport Phenomena and Materials Processing by Sindo Kou (English) Hardcover Bo

Description: Transport Phenomena and Materials Processing by Sindo Kou An extremely useful guide to the theory and applications of transport phenomena in materials processing This book defines the unique role that transport phenomena play in materials processing and offers a graphic, comprehensive treatment unlike any other book on the subject. The two parts of the text are, in fact, two useful books. FORMAT Hardcover LANGUAGE English CONDITION Brand New Publisher Description An extremely useful guide to the theory and applications of transport phenomena in materials processing This book defines the unique role that transport phenomena play in materials processing and offers a graphic, comprehensive treatment unlike any other book on the subject. The two parts of the text are, in fact, two useful books. Part I is a very readable introduction to fluid flow, heat transfer, and mass transfer for materials engineers and anyone not yet thoroughly familiar with the subject. It includes governing equations and boundary conditions particularly useful for studying materials processing. For mechanical and chemical engineers, and anyone already familiar with transport phenomena, Part II covers the many specific applications to materials processing, including a brief description of various materials processing technologies. Readable and unencumbered by mathematical manipulations (most of which are allocated to the appendixes), this book is also a useful text for upper-level undergraduate and graduate-level courses in materials, mechanical, and chemical engineering. It includes hundreds of photographs of materials processing in action, single and composite figures of computer simulation, handy charts for problem solving, and more. Transport Phenomena and Materials Processing: Describes eight key materials processing technologies, including crystal growth, casting, welding, powder and fiber processing, bulk and surface heat treating, and semiconductor device fabricationCovers the latest advances in the field, including recent results of computer simulation and flow visualizationPresents special boundary conditions for transport phenomena in materials processingIncludes charts that summarize commonly encountered boundary conditions and step-by-step procedures for problem solvingOffers a unique derivation of governing equations that leads to both overall and differential balance equationsProvides a list of publicly available computer programs and publications relevant to transport phenomena in materials processing Back Cover An extremely useful guide to the theory and applications of transport phenomena in materials processing This book defines the unique role that transport phenomena play in materials processing and offers a graphic, comprehensive treatment unlike any other book on the subject. The two parts of the text are, in fact, two useful books. Part I is a very readable introduction to fluid flow, heat transfer, and mass transfer for materials engineers and anyone not yet thoroughly familiar with the subject. It includes governing equations and boundary conditions particularly useful for studying materials processing. For mechanical and chemical engineers, and anyone already familiar with transport phenomena, Part II covers the many specific applications to materials processing, including a brief description of various materials processing technologies. Readable and unencumbered by mathematical manipulations (most of which are allocated to the appendixes), this book is also a useful text for upper-level undergraduate and graduate-level courses in materials, mechanical, and chemical engineering. It includes hundreds of photographs of materials processing in action, single and composite figures of computer simulation, handy charts for problem solving, and more. Transport Phenomena and Materials Processing: Describes eight key materials processing technologies, including crystal growth, casting, welding, powder and fiber processing, bulk and surface heat treating, and semiconductor device fabrication Covers the latest advances in the field, including recent results of computer simulation and flow visualization Presents special boundary conditions for transport phenomena in materials processing Includes charts that summarize commonly encountered boundary conditions and step-by-step procedures for problem solving Offers a unique derivation of governing equations that leads to both overall and differential balance equations Provides a list of publicly available computer programs and publications relevant to transport phenomena in materials processing Flap An extremely useful guide to the theory and applications of transport phenomena in materials processing This book defines the unique role that transport phenomena play in materials processing and offers a graphic, comprehensive treatment unlike any other book on the subject. The two parts of the text are, in fact, two useful books. Part I is a very readable introduction to fluid flow, heat transfer, and mass transfer for materials engineers and anyone not yet thoroughly familiar with the subject. It includes governing equations and boundary conditions particularly useful for studying materials processing. For mechanical and chemical engineers, and anyone already familiar with transport phenomena, Part II covers the many specific applications to materials processing, including a brief description of various materials processing technologies. Readable and unencumbered by mathematical manipulations (most of which are allocated to the appendixes), this book is also a useful text for upper-level undergraduate and graduate-level courses in materials, mechanical, and chemical engineering. It includes hundreds of photographs of materials processing in action, single and composite figures of computer simulation, handy charts for problem solving, and more. Transport Phenomena and Materials Processing: * Describes eight key materials processing technologies, including crystal growth, casting, welding, powder and fiber processing, bulk and surface heat treating, and semiconductor device fabrication * Covers the latest advances in the field, including recent results of computer simulation and flow visualization * Presents special boundary conditions for transport phenomena in materials processing * Includes charts that summarize commonly encountered boundary conditions and step-by-step procedures for problem solving * Offers a unique derivation of governing equations that leads to both overall and differential balance equations * Provides a list of publicly available computer programs and publications relevant to transport phenomena in materials processing Author Biography Sindo Kou is Professor of Materials Science and Engineering at the University of Wisconsin. He formerly held the positions of associate professor at Carnegie-Mellon University and senior researcher at the General Motors Research Lab. Dr. Kou has won several awards in his field and is the author of Welding Metallurgy (Wiley). Table of Contents INTRODUCTION TO TRANSPORT PHENOMENA. Introduction to Fluid Flow. Introduction to Heat Transfer. Introduction to Mass Transfer. Fluid Flow, Heat Transfer, and Mass Transfer: Similarities and Coupling. Boundary Conditions at Interfaces. APPLICATIONS OF TRANSPORT PHENOMENA IN MATERIALS PROCESSING. Selected Materials Processing Technologies. Fluid Flow in Materials Processing. Heat Transfer in Materials Processing. Mass Transfer in Materials Processing. Appendices. Index. Long Description An extremely useful guide to the theory and applications of transport phenomena in materials processing This book defines the unique role that transport phenomena play in materials processing and offers a graphic, comprehensive treatment unlike any other book on the subject. The two parts of the text are, in fact, two useful books. Part I is a very readable introduction to fluid flow, heat transfer, and mass transfer for materials engineers and anyone not yet thoroughly familiar with the subject. It includes governing equations and boundary conditions particularly useful for studying materials processing. For mechanical and chemical engineers, and anyone already familiar with transport phenomena, Part II covers the many specific applications to materials processing, including a brief description of various materials processing technologies. Readable and unencumbered by mathematical manipulations (most of which are allocated to the appendixes), this book is also a useful text for upper-level undergraduate and graduate-level courses in materials, mechanical, and chemical engineering. It includes hundreds of photographs of materials processing in action, single and composite figures of computer simulation, handy charts for problem solving, and more. Transport Phenomena and Materials Processing: ∗ Describes eight key materials processing technologies, including crystal growth, casting, welding, powder and fiber processing, bulk and surface heat treating, and semiconductor device fabrication ∗ Covers the latest advances in the field, including recent results of computer simulation and flow visualization ∗ Presents special boundary conditions for transport phenomena in materials processing ∗ Includes charts that summarize commonly encountered boundary conditions and step-by-step procedures for problem solving ∗ Offers a unique derivation of governing equations that leads to both overall and differential balance equations ∗ Provides a list of publicly available computer programs and publications relevant to transport phenomena in materials processing Feature Includes numerous examples that reinforce concepts. Contains useful analytical and numerical solutions to problems. Details ISBN0471076678 Author Sindo Kou Short Title TRANSPORT PHENOMENA & MATERIAL Pages 696 Language English ISBN-10 0471076678 ISBN-13 9780471076674 Media Book Format Hardcover DEWEY 670 Illustrations Yes Year 1996 Place of Publication New York Country of Publication United States Edition 1st Affiliation Univ. of Wisconsin, Madison Department of Materials Science and Engine DOI 10.1604/9780471076674 UK Release Date 1996-11-29 AU Release Date 1996-11-01 NZ Release Date 1996-11-01 Publisher John Wiley & Sons Inc Publication Date 1996-11-29 Imprint Wiley-Interscience Audience Undergraduate US Release Date 1996-11-29 We've got this At The Nile, if you're looking for it, we've got it. With fast shipping, low prices, friendly service and well over a million items - you're bound to find what you want, at a price you'll love! TheNile_Item_ID:3542940;

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